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High Density Interconnect(HDI) PCBs

In 2016, Bittele Electronics improved its manufacturing facilities in China by adding High Density Interconnect(HDI) PCB manufacturing to its comprehensive capabilities in PCB fabrication and assembly.

HDI PCBs are printed circuit boards with a much higher wiring and pad connection density than a traditional PCB. HDI PCBs are characterized by finer lines, closer spaces, smaller capture pads, and micro-sized vias. HDI PCB manufacturing is a growing area since the market demand for lightweight and thinner PCBs that can handle high-speed signals with reduced signal loss has steadily increased as consumer electronic end-products are produced in smaller form factors.

As a result of the market demand for HDI PCB manufacturing, Bittele Electronics has served clients from many industries, including:

  1. Automotive (Engine Control Units, GPS, Dashboard Electronics)
  2. Computers (Laptops, Tablets, Wearable Electronics, Internet of Things - IoT)
  3. Communication (Mobile phones, Modules, Routers, Switches)
  4. Digitial (Cameras, Audio, Video)

Our manufacturing facilities in China have the following HDI PCB manufacturing capabilities:

  1. Buried, Blind and Micro Vias
  2. NCVF
  3. Copper Fill
  4. Sequential Lamination
  5. 3/3 Traces/Space
  6. 5% Impedance

At the present time, Bittele Electronics can produce sequential lamination board up to 40 layers. Our facilities have been fitted with the most advanced Laser Drill Machines that are capable of laser drilling holes as small as 0.002 inch. With the latest HDI technology, we can produce inner and outer layers with as little as a 3/3 Trace/Space featuring excellent registration. We also have very large inventory of raw PCB materials, including NA & exotic materials.

Please refer to the technology roadmap below to see the full list of our HDI capabilities.

Bittele HDI Technology Matrix
Laser Drill0.002"
Copper Pad0.008"
Micro ViaMax. 8
Smallest BGA0.40 mm

Bittele Electronics is committed to continuously improving and refining its HDI PCB manufacturing services. In 2017, our target goal is to add the following capabilities: Megatron 4 and 6 Material, less than 5% impedance testing, wire bonding, and less than 0.003" Trace/Space.

For more detailed information on the HDI technologies we use in our manufacturing facilities, please contact us for more details.

The picture on the right illustrates the type of HDI we specialize in. We carry 1/4 oz and 3/8 oz Foils for your HDI needs. We are also capable of performing back drilling, controlled depth drilling, and Press Fit holes (tight hole tolerance). Bittele has ability to use cores (laminates) as thin as 0.001." We also offer Buried Capacitance (BC) Cores. Other technologies include dual FINISH, multiple color soldermask & silk screen, short gold fingers, hybrid builds, etc.

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Design For Assembly (DFA) guide
Bill of Material (BOM) Examples
Assembly Drawing Examples
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